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sOLDERING MACHINE FOR

SEMICONDUCTORS MODULES

MAIN FEATURES

    • “Heavy” industrial standard
    • Anodized aluminum frame – structure
    • Precision-milled aluminum bench and parts 
    • Soldering pin power on DCB (Die Ceramic Bond)
    • Brushless CNC axes
    • Process completely automated
    • Automatic feeding of the various components
    • Sinergo induction heater
    • High productivity
    • High quality welding
    • Know-how patented
    • Complete programming of set-up parameters
    • Machine management software developed by Sinergo
    • Software optimisation accordingly to the Customer requirement
    • Access with password at different levels
    • Statistical functions
    • Automatic test for welded pieces
    • Complete management for each model
    • Remote robot control and service over internet
    • Machine in conformity with ESD rules